Samsung Electronics and Broadcom have signed a memorandum of understanding to expand cooperation on artificial-intelligence semiconductors, with the companies estimating more than $200 billion of activity over five years through 2030. Announced on July 25 at an AI summit in San Francisco, the plan covers high-bandwidth memory, contract chip manufacturing and advanced packaging for next-generation computing infrastructure.
Samsung said the memory portion would include HBM products intended to support Broadcom's future AI accelerators. These specialized memory chips move large volumes of data rapidly between processors, making them a critical component in systems that train and run increasingly demanding AI models. Reuters reported that technology companies are seeking more custom accelerators instead of relying only on general-purpose graphics processors.
The foundry portion focuses on Samsung's 2-nanometer and smaller manufacturing processes for Broadcom products, including wireless broadband communications solutions. The companies also plan to explore 2.3D and 2.5D advanced packaging, techniques that integrate memory and logic components closely to improve performance and energy efficiency in AI and networking chips.
The announcement brought together Samsung Foundry president Jinman Han, Broadcom chief executive Hock Tan, other company executives and Korean government representatives. Samsung's official release described the arrangement as an MOU, so the stated value represents the expected scale of collaboration rather than completed revenue or a fully executed purchase contract.
For Samsung, long-term commitments from a major designer of custom AI chips could improve use of its advanced factories and strengthen a foundry business competing with market leader TSMC. Reuters noted that Samsung has been pursuing large technology customers and previously secured a $16.5 billion logic-chip manufacturing contract with electric-vehicle maker Tesla.
The partnership also illustrates how the AI infrastructure boom is binding chip designers, memory suppliers, foundries and packaging specialists into broader alliances. Samsung and Broadcom said close coordination across those layers can produce faster and more power-efficient silicon. Their next step is to turn the framework into product, supply and manufacturing programs running through 2030.
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