China has begun producing domestically developed immersion deep-ultraviolet lithography machines, according to Reuters and The Information, marking a potentially important step in Beijing's effort to reduce dependence on foreign semiconductor equipment. Reuters reported on Tuesday, July 28, that state-owned Shanghai Aishengna Electronic Technology Group is leading the work, citing a person familiar with the sensitive program.
The Information first reported that a state-backed Shanghai manufacturer had entered production and planned to make about five systems in 2026 and roughly 20 in 2027. Reuters subsequently identified the company as Aishengna. The machines are expected to go this year to Semiconductor Manufacturing International Corporation, Hua Hong Semiconductor and memory producer ChangXin Memory Technologies, although those companies did not confirm the plans.
Immersion DUV systems project circuit patterns onto silicon wafers and remain essential across the chip industry. They can produce 28-nanometer-class features in one exposure and can support smaller process nodes through repeated patterning, a more complex method that can reduce yield. ASML, the Dutch supplier that dominates this market, says its latest immersion platform operates in high-volume production at more than 300 wafers per hour with sub-nanometer overlay accuracy.
Reuters said Aishengna incorporated teams from Shanghai Yuliangsheng Technology and Shanghai Micro Electronics Equipment. Corporate records cited by the agency show that Aishengna began in August 2023 with registered capital of 7 billion yuan, about 1 billion dollars, and two state-owned shareholders. Specialist reporting said most components are domestic but some critical parts still come from Japan, while supplier delays have constrained output.
The development does not establish that China can yet match ASML or reliably use the machines in commercial production. Reuters said the equipment requires further testing and remains far behind competing Dutch systems. Tom's Hardware noted that qualification in working fabrication plants can take many months, while ASML describes DUV as an industry workhorse and continues to expand the performance and capacity of its own platforms.
The program nevertheless could provide Chinese chipmakers with an alternative if Western governments further restrict exports or servicing. China cannot buy ASML's most advanced extreme-ultraviolet systems, and Dutch controls also cover some advanced DUV equipment. The immediate test will be whether Aishengna meets delivery targets and whether SMIC, Hua Hong and CXMT can qualify the systems without sacrificing reliability, throughput or chip yields.
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